IP Library Patent Application 15278203
Patent Application
App. No. 15/278,203

LONG-LASTING WETTABLE FLANKS

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Quick Facts
Patent No.
US None
App. No.
15/278,203
Abstract

A method for plating package leads, in some embodiments, comprises: providing a package having a lead electrically coupled to a tie bar; singulating said lead; electroplating said singulated lead using the tie bar; and singulating said tie bar.

Claims (34)

1 . A method for plating package leads, comprising:

providing a package having a lead electrically coupled to one or more tie bars;

singulating said lead;

electroplating said singulated lead by passing a current from a lead frame to the singulated lead solely via the one or more tie bars; and

singulating said one or more tie bars.

2 . The method of claim 1 , wherein singulating the lead comprises causing an end of the lead to be flush with a side surface of the package.

3 . The method of claim 1 , wherein singulating the lead comprises punching.

4 . The method of claim 1 , wherein singulating the lead comprises sawing.

5 . The method of claim 1 , wherein said electroplating comprises electroplating the lead with tin.

6 . The method of claim 1 , wherein said electroplating results in said lead having a plating at least 7 microns thick.

7 . (canceled)

8 . The method of claim 1 , wherein passing said current via the one or more tie bars results in another lead of the package being electroplated, said lead and the another lead electrically coupled to each other.

9 . The method of claim 1 , wherein providing the package comprises electrically coupling said lead to said one or more tie bars.

10 . The method of claim 1 , wherein said package comprises a second lead and a third lead, and wherein passing said current via the one or more tie bars to electroplate the lead also results in electroplating the second lead but not the third lead.

11 . The method of claim 10 , further comprising applying another current to a second tie bar coupled to the third lead to electroplate the third lead.

12 . A method, comprising:

providing a package having first, second and third electrical terminals, said first and second electrical terminals electrically coupled to each other and to a first tie bar, said third electrical terminal electrically coupled to a second tie bar;

singulating the first, second and third electrical terminals;

passing a current from a lead frame to the first and second electrical terminals solely via the first tie bar after singulating the first and second electrical terminals to electroplate the first and second electrical terminals;

passing another current from the lead frame to the third electrical terminal solely via the second tie bar after singulating the third electrical terminal to electroplate the third electrical terminal;

singulating the first tie bar after electroplating the first and second electrical terminals; and

singulating the second tie bar after electroplating the third electrical terminal.

13 . The method of claim 12 , wherein passing said current and said another current to electroplate the first, second and third electrical terminals comprises electroplating with tin.

14 . The method of claim 12 , wherein passing said current and said another current to electroplate the first, second and third electrical terminals comprises applying an electroplating thickness of at least 7 microns.

15 . The method of claim 12 , wherein singulating the first, second and third electrical terminals comprises exposing flanks of said package.

16 . A package, comprising:

a first singulated lead;

a second singulated lead electrically isolated from the first singulated lead;

a first tie bar electrically coupled to the first singulated lead and adapted for electroplating the first singulated lead; and

a second tie bar electrically coupled to the second singulated lead and adapted for electroplating the second singulated lead.

17 . The package of claim 16 , further comprising electroplating disposed on the first singulated lead, the second singulated lead, or both.

18 . The package of claim 17 , wherein the first and second tie bars are singulated.

19 . The package of claim 17 , wherein said electroplating comprises tin.

20 . The package of claim 16 , further comprising a third singulated lead electrically coupled to the first singulated lead and electrically isolated from the second lead, said first tie bar adapted for electroplating the third singulated lead.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 041187, FRAME 0295 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →
SECURITY INTEREST Recorded Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2016
From: THEN, NAM KHONG; CELAYA, PHILLIP; LER, HUI MIN; CHEW, CHEE HIONG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039903/0288 →