Electronic device including a multiple channel HEMT and an insulated gate electrode

1. An electronic device comprising:

a first channel layer;

a first semiconductor layer overlying the first channel layer;

a second channel layer overlying the first channel layer;

a second semiconductor layer overlying the second channel layer, wherein the first semiconductor layer has a lower Al content as compared to the second semiconductor layer;

an insulator within an opening extending through the second semiconductor layer and the second channel layer; and

a gate electrode extending into the opening, wherein the insulator is disposed between the gate electrode and each of the second semiconductor layer and the second channel layer,

wherein a double channel transistor includes the first and second channel layers and the gate electrode.

2. The electronic device of claim 1 , wherein the insulator is an oxide, an oxynitride, or a nitride.

3. The electronic device of claim 1 , wherein:

the first semiconductor layer includes Al b Ga (1-b) N, wherein 0.10≦b≦0.30; and

the second semiconductor layer includes Al d Ga (1-d) N, wherein 0.15≦d≦0.35.

4. The electronic device of claim 1 , wherein the insulator is disposed between the gate electrode and the second semiconductor layer.

5. The electronic device of claim 3 , wherein:

the first channel layer includes Al a Ga (1-a) N, wherein 0.0≦a≦0.1; and

the second channel layer includes Al c Ga (1-c) N, wherein 0.0≦c≦0.15.

6. The electronic device of claim 5 , wherein a=0, and c=0.

7. The electronic device of claim 1 , wherein the first channel layer is thicker than the second channel layer and has a thickness of at most 1000 nm.

8. The electronic device of claim 1 , further comprising a passivation layer overlying the second semiconductor layer.

9. The electronic device of claim 1 , wherein each of the first and second channel layers and the first and second semiconductor layers has a dopant concentration of at most 1×10 15 atoms/cm 3 .

10. The electronic device of claim 1 , further comprising:

a source electrode overlying the substrate, wherein a lowermost surface of the source electrode overlies the second semiconductor layer; and

a drain electrode overlying the substrate, wherein a lowermost surface of the source electrode overlies the second semiconductor layer.

11. The electronic device of claim 1 , further comprising a conductive member electrically connected to the first and second channel layers, wherein the conductive member is disposed between the insulator and the second channel layer.

12. An electronic device including a transistor, the transistor comprising:

a first channel layer;

a second channel layer overlying the first channel layer;

a gate electrode;

a source electrode;

a drain electrode; and

a conductive member is electrically connected to the first and second channel layers, is between and spaced apart from the source and drain electrodes, and does not electrically short the first and second channel layers to the gate electrode.

13. A process of forming an electronic device comprising:

providing a workpiece including a substrate, a first channel layer overlying the substrate, a first semiconductor layer and overlying the first channel layer, a second channel layer overlying the first semiconductor layer, and a second semiconductor layer overlying the second channel layer, wherein the first semiconductor layer has a lower Al content as compared to the second semiconductor layer;

patterning the second semiconductor layer and the second channel layer to define an opening extending through the second semiconductor layer and the second channel layer;

forming an insulator within the opening; and

forming a first gate electrode that extends into the opening after forming the insulator, wherein a first transistor includes the first and second channel regions and the first gate electrode.

14. The process of claim 13 , wherein the first gate electrode is insulated from the second channel layer by the insulator.

15. The process of claim 13 , wherein providing the workpiece comprises:

forming the first channel layer over the substrate;

forming a first semiconductor layer after forming the first channel layer;

forming the second channel layer after forming the first semiconductor layer; and

forming a second semiconductor layer after forming the second channel layer.

16. The process of claim 15 , further comprising:

forming a source electrode to the first and second channel layers, and

forming a drain electrode to the first and second channel layers,

wherein:

providing the workpiece comprises forming a buffer layer over the substrate before forming the first channel layer;

forming the first channel layer includes forming a first GaN channel layer over the buffer layer, wherein the first GaN channel layer has a thickness in a range of 11 nm to 1000 nm;

the first semiconductor includes Al b Ga (1-b) N, wherein 0.10≦b≦0.30 and has a thickness in a range of 10 nm to 40 nm;

forming the second channel layer comprises forming a second GaN channel layer over the first semiconductor layer, is thinner than the first channel layer, and has a thickness in a range of 10 nm to 200 nm; and

the second semiconductor layer includes Al d Ga (1-d) N, wherein 0.15≦d≦0.35 and has a thickness in a range of 10 nm to 40 nm.

17. The process of claim 13 , wherein each of the first and second channel layers has a dopant concentration of at most 1×10 15 atoms/cm 3 .

18. The process of claim 13 , further comprising forming a second gate electrode of a second transistor over the first and second channel layers, wherein a drain of the first transistor is coupled to the source of the second transistor.

19. The process of claim 18 , wherein the first transistor is an enhancement-mode, double-channel HEMT, and the second transistor is a depletion-mode, double-channel HEMT.

20. The process of claim 13 , further comprising:

forming an insulating layer over the second channel layer;

patterning the insulating layer to define a source contact opening and a drain contact opening, wherein the second semiconductor layer is exposed along a bottom of the source and drain contact openings; and

forming a source electrode and a drain electrode within the source and drain contact openings.