Semiconductor device and method of forming micro interconnect structures
View Patent ↗A semiconductor device has a first semiconductor die and second semiconductor die with a conductive layer formed over the first semiconductor die and second semiconductor die. The second semiconductor die is disposed adjacent to the first semiconductor die with a side surface and the conductive layer of the first semiconductor die contacting a side surface and the conductive layer of the second semiconductor die. An interconnect, such as a conductive material, is formed across a junction between the conductive layers of the first and second semiconductor die. The conductive layer may extend down the side surface of the first semiconductor die and further down the side surface of the second semiconductor die. An extension of the side surface of the first semiconductor die can interlock with a recess of the side surface of the second semiconductor die. The conductive layer extends over the extension and into the recess.
1. A method of making a semiconductor device, comprising:
providing a first semiconductor die and second semiconductor die;
forming a first conductive layer on a first major surface of the first semiconductor die and further on a side surface of the first semiconductor die to extend between the first major surface of the first semiconductor die and a second major surface of the first semiconductor die;
forming a second conductive layer on a first major surface of the second semiconductor die and further on a side surface of the second semiconductor die to extend between the first major surface of the second semiconductor die and a second major surface of the second semiconductor die; and
disposing the second semiconductor die adjacent to the first semiconductor die with the side surface of the first semiconductor die contacting the side surface of the second semiconductor die and the first conductive layer formed on the side surface of the first semiconductor die contacting the second conductive layer formed on the side surface of the second semiconductor die.
2. The method of claim 1 , further including forming an interconnect across the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die.
3. The method of claim 1 , further including:
forming an extension of the side surface of the first semiconductor die;
forming a recess of the side surface of the second semiconductor die; and
disposing the extension into the recess to interlock the first semiconductor die and second semiconductor die.
4. The method of claim 1 , further including utilizing a plasma etching process on the side surfaces of the first semiconductor die and second semiconductor die.
5. The method of claim 1 , wherein the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die include a conductive epoxy or anisotropic conductive film.
6. A semiconductor device, comprising:
a first semiconductor die;
a second semiconductor die;
a first conductive layer formed on a first major surface of the first semiconductor die and further formed on a first side surface of the first semiconductor die to extend between the first major surface of the first semiconductor die and a second major surface of the first semiconductor die; and
a second conductive layer formed on a first major surface of the second semiconductor die and further formed on a first side surface of the second semiconductor die to extend between the first major surface of the second semiconductor die and a second major surface of the second semiconductor die, wherein the second semiconductor die is disposed adjacent to the first semiconductor die with the first side surface of the first semiconductor die contacting the first side surface of the second semiconductor die and the first conductive layer formed on the first side surface of the first semiconductor die contacting the second conductive layer formed on the first side surface of the second semiconductor die.
7. The semiconductor device of claim 6 , further including an interconnect formed over the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die.
8. The semiconductor device of claim 7 , wherein the interconnect includes a conductive material formed over a junction between the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die.
9. The semiconductor device of claim 6 , further including:
an extension of the first side surface of the first semiconductor die; and
a recess of the first side surface of the second semiconductor die, wherein the extension is disposed into the recess to interlock the first semiconductor die and second semiconductor die.
10. The semiconductor device of claim 9 , wherein the first conductive layer extends over the extension and the second conductive layer extends into the recess.
11. The semiconductor device of claim 6 , further including a third semiconductor die disposed adjacent to the first semiconductor die with a side surface of the third semiconductor die contacting a second side surface of the first semiconductor die.
12. The semiconductor device of claim 6 , wherein the first side surface of the first semiconductor die has a non-90 degree angle with respect to an adjacent second side surface of the first semiconductor die, and the first side surface of the second semiconductor die has a non-90 degree angle with respect to an adjacent second side surface of the second semiconductor die.
13. A semiconductor device, comprising:
a first semiconductor die;
a second semiconductor die;
a first conductive layer formed on a first side surface of the first semiconductor die; and
a second conductive layer formed on a first side surface of the second semiconductor die, wherein the second semiconductor die is disposed adjacent to the first semiconductor die with the first side surface of the first semiconductor die contacting the first side surface of the second semiconductor die and the first conductive layer formed on the first side surface of the first semiconductor die contacting the second conductive layer formed on the first side surface of the second semiconductor die.
14. The semiconductor device of claim 13 , further including an interconnect formed over the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die.
15. The semiconductor device of claim 14 , wherein the interconnect includes a conductive material formed over a junction between the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die.
16. The semiconductor device of claim 13 , further including:
an extension of the first side surface of the first semiconductor die; and
a recess of the first side surface of the second semiconductor die, wherein the extension is disposed into the recess to interlock the first semiconductor die and second semiconductor die.
17. The semiconductor device of claim 16 , wherein the first conductive layer extends over the extension and the second conductive layer extends into the recess.
18. The semiconductor device of claim 13 , wherein the first side surface of the first semiconductor die has a non-90 degree angle with respect to an adjacent second side surface of the first semiconductor die, and the first side surface of the second semiconductor die has a non-90 degree angle with respect to an adjacent second side surface of the second semiconductor die.