Single reflow power pin connections
View Patent ↗A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.
1. A system, comprising:
a direct bonded copper (DBC) substrate including a ceramic layer and copper traces on a surface of the ceramic layer;
hollow bush rings soldered to the copper traces;
a guide plate having protrusions mated with the bush rings, each of said bush rings having an end at which the wall of the bush ring has multiple raised portions and multiple depressed portions, said end located in a plane that is perpendicular to the longitudinal axis of the bush ring; and
a vacuum system having air passages positioned in the guide plate and in at least one of the protrusions.
2. The system of claim 1 , wherein said ends are soldered to the copper traces.
3. The system of claim 1 , wherein said raised portions extend away from the longitudinal axis of the bush ring.
4. The system of claim 1 , wherein said raised portions are parallel to the longitudinal axis of the bush ring.
5. The system of claim 1 , wherein said bush rings have substantially square cross sections when measured from outer wall surface to outer wall surface.
6. The system of claim 1 , further comprising a die soldered to one of the copper traces.