Semiconductor device and method of manufacture
View Patent ↗In one embodiment, an IGBT is formed to include a region of semiconductor material. Insulated gate structures are disposed in region of semiconductor material extending from a first major surface. An n-type field stop region extends from a second major surface into the region of semiconductor material. A p+ type polycrystalline semiconductor layer is disposed adjacent to the field stop region and provides an emitter region for the IGBT. An embodiment may include a portion of the p+ type polycrystalline semiconductor being doped n-type.
1. A method for forming a semiconductor device comprising:
providing a first substrate having a first major surface and a second major surface opposed to the first major surface;
forming a first doped region of a first conductivity type extending from the first major surface into the first substrate;
providing a polycrystalline semiconductor layer adjacent to the first major surface;
providing a second substrate having a dielectric layer disposed proximate to an outer surface;
attaching the second substrate to the first substrate such that the dielectric layer adjoins the polycrystalline semiconductor layer;
forming insulated gate structures adjacent the second major surface of the first substrate;
removing the second substrate to expose at least a portion of the dielectric layer;
removing at least a portion of the dielectric layer to expose at least a portion of the polycrystalline semiconductor layer;
doping at least a portion of the polycrystalline semiconductor layer with a dopant of a second conductivity type; and
forming a first electrode layer electrically coupled to the polycrystalline semiconductor layer, wherein the polycrystalline semiconductor layer provides an emitter region for the semiconductor device.
2. The method of claim 1 , wherein attaching comprises bonding the dielectric layer to the polycrystalline semiconductor layer.
3. The method of claim 1 , wherein doping the polycrystalline semiconductor layer comprises:
ion implanting a dopant of the second conductivity type into the polycrystalline semiconductor layer; and
annealing the dopant.
4. The method of claim 3 , wherein:
ion implanting comprises using a plurality of ion implants; and
at least one ion implant forms a second conductivity type doped region within the first substrate adjacent the first major surface.
5. The method of claim 1 , wherein forming the first doped region comprises diffusing dopant of the first conductivity type from the polycrystalline semiconductor layer into the first substrate.
6. The method of claim 1 further comprising planarizing the polycrystalline semiconductor layer before attaching the second substrate.
7. The method of claim 6 further comprising oxidizing the polycrystalline semiconductor layer before planarizing.
8. The method of claim 1 further comprising:
incorporating one or more of phosphorous, arsenic, antimony, protons, and helium into the first substrate through the first major surface.
9. The method of claim 1 , wherein providing the polycrystalline semiconductor layer comprises forming a polysilicon layer having a thickness in a range from approximately 1,000 Angstroms through 20,000 Angstroms.
10. The method of claim 1 , wherein providing the polycrystalline semiconductor layer occurs before forming the first doped region.
11. The method of claim 1 , wherein forming the insulated gate structures comprises:
forming a second doped region of a second conductivity type extending from the second major surface of the first substrate into the first substrate;
forming the insulated gate electrode structures adjoining the second major surface;
forming source regions of the first conductivity type adjacent the insulated gate electrode structures and within the second doped region; and
forming a second electrode layer electrically coupled to the source regions.
12. The method of claim 1 , wherein removing the second substrate comprises:
grinding a first portion of the second substrate; and
etching a second portion of second substrate to expose at least a portion of the dielectric layer.
13. The method of claim 1 , wherein forming the first doped region comprises forming using a plurality of ion implants.