Damaging components with defective electrical couplings

1. A method, comprising:

providing a component having first and second electrical nodes;

determining that the component lacks multiple, functional electrical couplings between said first and second nodes;

damaging at least part of the component by shorting said first node to said second node as a result of said determination; and

determining, as a result of said damage, that the component is defective.

2. The method of claim 1 , wherein said damaging comprises using a laser to short one or more electrical connections in the component.

3. A method, comprising:

providing a component having first and second electrical nodes;

determining that the component lacks multiple, functional electrical couplings between said first and second nodes;

damaging at least part of the component as a result of said determination using a laser to open one or more electrical connections in the component; and

determining, as a result of said damage, that the component is defective.

4. The method of claim 3 , wherein using the laser to open the one or more electrical connections comprises opening an electrical coupling between the first and second nodes.

5. The method of claim 4 , wherein said electrical coupling between the first and second nodes is selected from the group consisting of: wire bonds, clip bonds and ribbon bonds.

6. The method of claim 1 , wherein said damaging comprises dispensing an electrically conductive material to short one or more electrical connections in the component.

7. The method of claim 1 , wherein said damaging comprises electrically coupling a top surface of a die to a bottom surface of the die.

8. The method of claim 1 , wherein said damaging comprises electrically coupling a top or bottom surface of a die to a side surface of the die.

9. A method, comprising:

providing a component having first and second electrical nodes;

determining that the component lacks multiple, functional electrical couplings between said first and second nodes;

damaging at least part of the component as a result of said determination using an electrostatic discharge; and

determining, as a result of said damage, that the component is defective.

10. The method of claim 1 , further comprising performing said damage using a wire bonding machine.

11. The method of claim 1 , wherein determining that the component is defective comprises determining that the component is defective during an electrical test.

12. A method, comprising:

providing a component having multiple electrical nodes;

identifying a defect in an electrical coupling scheme between said multiple nodes; and

introducing electrical damage to the component upon identifying said defect to impair function of the component by shorting at least two of said multiple nodes together,

wherein introducing said electrical damage comprises at least one of applying laser light to the component or dispensing electrically conductive material into the component or electrically coupling two separate surfaces of a die in said component.

13. The method of claim 12 , wherein said component is selected from the group consisting of: an integrated circuit package, a discrete device package, a multi-die device, a multi-chip module, a system in package, and a passive device.

14. The method of claim 12 , wherein said component comprises a diode or a transistor.

15. The method of claim 12 , wherein said multiple nodes include a component terminal and a surface of a die.

16. The method of claim 12 , wherein said electrical coupling scheme includes one or more electrical couplings between the multiple nodes.

17. The method of claim 12 , further comprising:

performing an electrical test after introducing said electrical damage; and

determining, as a result of said electrical test, that said component is defective.