IMAGING SYSTEMS WITH GLOBAL SHUTTER PHASE DETECTION PIXELS
An image sensor may include a pixel array with global shutter phase detection pixels. The global shutter phase detection pixels may include global shutter charge storage regions. To prevent the global shutter charge storage regions from being exposed to incident light, a shielding layer may be provided. The shielding layer may also cover portions of underlying photodiodes to produce an asymmetric response to incident light in the underlying photodiodes. The shielding layer may be formed as backside trench isolation with an absorptive metal. The absorptive metal may absorb incident light, reducing the likelihood of the incident light reaching the charge storage regions. An additional absorptive layer may also be provided on or in the shielding layer.
1 . An image sensor having a pixel array, wherein the pixel array comprises:
a first global shutter phase detection pixel with a first photodiode that is covered by a first microlens;
a second global shutter phase detection pixel with a second photodiode that is covered by a second microlens;
an shielding layer that covers at least a portion of the first photodiode and at least a portion of the second photodiode; and
a charge storage region formed underneath the shielding layer, wherein the shielding layer shields the charge storage region from incident light.
2 . The image sensor defined in claim 1 , wherein the shielding layer is opaque to visible light.
3 . The image sensor defined in claim 2 , wherein the shielding layer is formed from an absorptive material.
4 . The image sensor defined in claim 3 , wherein the shielding layer comprises tungsten.
5 . The image sensor defined in claim 1 , wherein the shielding layer comprises backside trench isolation.
6 . The image sensor defined in claim 5 , wherein the shielding layer is coated with an anti-reflective coating.
7 . The image sensor defined in claim 6 , wherein the shielding layer is coated with an absorptive coating.
8 . The image sensor defined in claim 1 , wherein the shielding layer covers approximately half of the first photodiode and approximately half of the second photodiode.
9 . An image sensor comprising:
a silicon substrate with first and second opposing sides;
a first photodiode for a first phase detection pixel formed in the silicon substrate;
a second photodiode for a second phase detection pixel formed in the silicon substrate;
a trench formed in the silicon substrate that extends from the first side of the silicon substrate towards the second side of the silicon substrate;
a shielding layer formed in the trench; and
a global shutter storage region formed in the silicon substrate, wherein the shielding layer overlaps the global shutter storage region.
10 . The image sensor defined in claim 9 , wherein the shielding layer covers at least a portion of the first photodiode and at least a portion of the second photodiode.
11 . The image sensor defined in claim 10 , wherein the shielding layer covers approximately half of the first photodiode and approximately half of the second photodiode.
12 . The image sensor defined in claim 11 , wherein the shielding layer is formed from an absorptive material that absorbs incident light.
13 . The image sensor defined in claim 12 , further comprising:
an anti-reflective coating on the shielding layer.
14 . The image sensor defined in claim 13 , further comprising:
an absorptive coating on the shielding layer.
15 . The image sensor defined in claim 9 , further comprising:
a first microlens formed over the first photodiode; and
a second microlens formed over the second photodiode, wherein the first and second microlenses are formed on the first side of the silicon substrate.
16 . The image sensor defined in claim 15 , wherein the global shutter storage region is formed in the second side of the silicon substrate.
17 . An image sensor comprising:
a substrate with a front side and an opposing back side;
a first photodiode for a first phase detection pixel formed in the substrate;
a second photodiode for a second phase detection pixel formed in the substrate;
a first microlens on the back side of the substrate that covers the first photodiode;
a second microlens on the back side of the substrate that covers the second photodiode;
back side trench isolation formed in the substrate that extends from the back side of the substrate towards the front side of the substrate, wherein the back side trench isolation overlaps the first and second photodiodes; and
a storage region formed in the substrate, wherein the back side trench isolation shields the storage region from incident light.
18 . The image sensor defined in claim 17 , wherein the back side trench isolation overlaps approximately half of the first photodiode and approximately half of the second photodiode.
19 . The image sensor defined in claim 18 , wherein the back side trench isolation comprises tungsten and an anti-reflective coating.
20 . The image sensor defined in claim 19 , wherein the first and second phase detection pixels are configured to operate in a global shutter mode, and wherein the storage region is a global shutter storage region.