Patent Assignment
Reel/Frame 038599/0990
Assignment of Assignor's Interest
Recorded: 2016-05-03
Pages: 4
Assignors
HO, CHENG-LIN
Executed: 2016-02-03
LEE, CHIH-CHENG
Executed: 2016-02-03
PENG, PO-SHU
Executed: 2016-02-03
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Reduced-Dimension via-Land Structure and Method of Making the Same