Patent Assignment
Reel/Frame 038619/0116
Assignment of Assignor's Interest
Recorded: 2016-05-17
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2016-04-16
YEH, SUNG-FENG
Executed: 2016-04-12
CHEN, MING-FA
Executed: 2016-04-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3DIC Formation with Dies Bonded to Formed Rdls