IP Library Assignment 038626/0373
Patent Assignment
Reel/Frame 038626/0373

Assignment of Assignor's Interest

Recorded: 2016-05-18 Pages: 4
Assignors
WANG, SHIH-HUI
Executed: 2016-04-21
CHENG, CHIH-HUNG
Executed: 2016-04-21
LIN, YUNG-CHI
Executed: 2016-04-21
CHIOU, WEN-CHIH
Executed: 2016-04-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Manufacturing Process and Package Carrier
Patent: 9,922,934 →
Application: 15/141,836 →
Publication: US 2017/0317033