Patent Assignment
Reel/Frame 038653/0342
Assignment of Assignor's Interest
Recorded: 2016-05-20
Pages: 4
Assignors
HUANG, LI-HSIEN
Executed: 2016-05-16
SU, AN-JHIH
Executed: 2016-05-16
CHEN, HSIEN-WEI
Executed: 2016-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structures and Methods of Forming the Same