Patent Assignment
Reel/Frame 038691/0278
Assignment of Assignor's Interest
Recorded: 2016-05-24
Pages: 6
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Property
(1)
Epoxy Resin Composition for Encapsulating Semiconductor Device and Semiconductor Device Encapsulated by the Same