Patent Assignment
Reel/Frame 038698/0567
Assignment of Assignor's Interest
Recorded: 2016-05-24
Pages: 3
Assignors
HSU, WEN-SUNG
Executed: 2016-05-09
LIN, SHIH-CHIN
Executed: 2016-05-09
CHENG, TAO
Executed: 2016-05-09
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package, Semiconductor Device Using the Same and Manufacturing Method Thereof