Patent Assignment
Reel/Frame 038698/0630
Assignment of Assignor's Interest
Recorded: 2016-05-24
Pages: 4
Assignors
HSU, WEN-SUNG
Executed: 2016-05-06
LIN, SHIH-CHIN
Executed: 2016-05-06
CHENG, TAO
Executed: 2016-05-06
CHANG, ANDREW C.
Executed: 2016-05-06
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package, Semiconductor Device Using the Same and Manufacturing Method Thereof