Patent Assignment
Reel/Frame 038709/0018
Assignment of Assignor's Interest
Recorded: 2016-05-24
Pages: 3
Assignors
KUSAMA, YASUHIKO
Executed: 2016-03-04
HASHIMOTO, HIRONOBU
Executed: 2016-03-04
CHINO, TAKESHI
Executed: 2016-03-04
KOBAYASHI, KAZUHIRO
Executed: 2016-03-04
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Electronic Component Built-in Substrate and Electronic Device