Patent Assignment
Reel/Frame 038728/0837
Assignment of Assignor's Interest
Recorded: 2016-05-26
Pages: 3
Assignors
HONG, SUK-CHANG
Executed: 2016-05-19
PARK, HYO-BIN
Executed: 2016-05-19
SHIN, DONG-KWANG
Executed: 2016-05-19
BAEK, SANG-JIN
Executed: 2016-05-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board, Method, and Semiconductor Package