Printed circuit board, method, and semiconductor package
A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.
1. A printed circuit board comprising:
first and second insulating layers forming a cavity;
a circuit layer formed on the first insulating layer in the cavity and including a ground pattern; and
a heat releasing layer disposed in contact with the circuit layer and the first and second insulating layers in the cavity, wherein the heat releasing layer comprises a conductive metal, is electrically connected to the circuit layer, and encapsulates the ground pattern.
2. A printed circuit board comprising:
first and second insulating layers forming a cavity;
a circuit layer formed on the first insulating layer in the cavity and including ground pattern; and
a heat releasing layer disposed in contact with the circuit layer and the first and second insulating layers in the cavity,
wherein the heat releasing layer is electrically connected to the circuit layer and encapsulates the ground pattern, and
wherein the printed circuit board is a second printed circuit board of a structure, the structure further comprising:
a first printed circuit board having a first component disposed on the first printed circuit board; and
a third printed circuit board having a second component disposed on the third printed circuit board, the first component being at least partially fixed inside the cavity.
3. The printed circuit board of claim 2 , wherein the heat releasing layer comprises a conductive metal.
4. The printed circuit board of claim 2 , further comprising a heat releasing member disposed between the first component and the heat releasing layer.
5. The printed circuit board of claim 4 , wherein the heat releasing member contacts the first component and the heat releasing layer.
6. The printed circuit board of claim 4 , wherein the heat releasing member comprises a conductive paste.
7. A structure comprising a printed circuit board, the printed circuit board comprising:
first and second insulating layers forming a cavity;
a circuit layer formed on the first insulating layer in the cavity; and
a heat releasing layer disposed in contact with the circuit layer and the first and second insulating layers in the cavity,
wherein the heat releasing layer comprises a conductive metal, is electrically connected to the circuit layer, contacts a ground pattern of the circuit layer, and encapsulates the ground pattern.