Patent Assignment
Reel/Frame 038730/0116
Assignment of Assignor's Interest
Recorded: 2016-05-26
Pages: 4
Assignor
HIRATA, KAZUYA
Executed: 2016-05-09
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Producing Method