Patent Assignment
Reel/Frame 038735/0169
Assignment of Assignor's Interest
Recorded: 2016-05-27
Pages: 5
Assignors
LAU, SIU WING
Executed: 2016-05-27
HUNG, KIN YIK
Executed: 2016-05-27
AU, YUK CHEUNG
Executed: 2016-05-27
LAI, WING CHIU
Executed: 2016-05-27
LEE, LEO MAN
Executed: 2016-05-27
GO, SAI YUEN
Executed: 2016-05-27
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Die Bonding Apparatus Comprising an Inert Gas Environment
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.