Patent Assignment
Reel/Frame 038741/0594
Assignment of Assignor's Interest
Recorded: 2016-05-28
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3FL., 157 LI-TE ROAD, PEITOU DIST., TAIPEI, 11259, TAIWAN
Covered Property
(1)
Thermally Enhanced Face-to-Face Semiconductor Assembly with Built-in Heat Spreader and Method of Making the Same