Patent Assignment
Reel/Frame 038786/0773
Assignment of Assignor's Interest
Recorded: 2016-06-02
Pages: 4
Assignor
XU, JIAN
Executed: 2016-05-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Barrier Members and Method of Manufacturing the Same