Patent Assignment
Reel/Frame 038815/0748
Assignment of Assignor's Interest
Recorded: 2016-06-06
Pages: 8
Assignors
KUO, FENG WEI
Executed: 2016-03-29
LIAO, WEN-SHIANG
Executed: 2016-03-29
JOU, CHEWN-PU
Executed: 2016-03-28
CHEN, HUAN-NENG
Executed: 2016-03-29
CHO, LAN-CHOU
Executed: 2016-03-29
SHEN, WILLIAM WU
Executed: 2016-03-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Coaxial Through via with Novel High Isolation Cross Coupling Method for 3D Integrated Circuits