IP Library › Assignment 038830/0361
Patent Assignment
Reel/Frame 038830/0361

Assignment of Assignor's Interest

Recorded: 2016-06-07 Pages: 5
Assignors
NORIMATSU, JUN
Executed: 2016-05-31
MIYASAKA, AKIRA
Executed: 2016-05-31
KAGESHIMA, YOSHIAKI
Executed: 2016-05-31
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Apparatus for Producing Sic Epitaxial Wafer and Method for Producing Sic Epitaxial Wafer
Application: 15/102,314 →
Publication: US 2016/0312381
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →