IP Library Assignment 038834/0170
Patent Assignment
Reel/Frame 038834/0170

Assignment of Assignor's Interest

Recorded: 2016-06-07 Pages: 8
Assignors
YU, KAI-HUNG
Executed: 2016-06-03
LEUSINK, GERRIT J.
Executed: 2016-06-03
WAJDA, CORY
Executed: 2016-06-06
ISHIZAKA, TADAHIRO
Executed: 2016-06-06
HAKAMATA, TAKAHIRO
Executed: 2016-06-06
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property (1)
Ruthenium Metal Feature Fill for Interconnects
Patent: 9,711,449 →
Application: 15/172,648 →
Publication: US 2016/0358815