Patent Assignment
Reel/Frame 038865/0674
Assignment of Assignor's Interest
Recorded: 2016-06-02
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Base Chip and Semiconductor Package Including the Same