IP Library Assignment 038872/0104
Patent Assignment
Reel/Frame 038872/0104

Assignment of Assignor's Interest

Recorded: 2016-06-10 Pages: 3
Assignor
HITACHI, LTD.
Executed: 2016-03-30
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device
Patent: 6,461,957 →
Application: 10/026,708 →
Publication: US 2002/0123216
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 24, 2016
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 038241/0507 →