IP Library Assignment 038872/0172
Patent Assignment
Reel/Frame 038872/0172

Assignment of Assignor's Interest

Recorded: 2016-06-10 Pages: 4
Assignors
CHEN, QIANWEN
Executed: 2016-06-07
DANG, BING
Executed: 2016-06-07
KNICKERBOCKER, JOHN
Executed: 2016-06-06
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Wafer Stacking for Integrated Circuit Manufacturing
Application: 15/178,709 →
Publication: US 2017/0358554
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052620/0961 →