Patent Assignment
Reel/Frame 038879/0569
Assignment of Assignor's Interest
Recorded: 2016-06-10
Pages: 8
Assignors
KIM, HYUN-JUN
Executed: 2016-06-01
LEE, SUNG-SOO
Executed: 2016-06-02
HONG, HWAN-SUN
Executed: 2016-06-02
LEE, JA-HUN
Executed: 2016-06-02
LEE, CHEOL-HEE
Executed: 2016-06-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Broadcast Signal Receiving Apparatus and Multi-Layer Printed Circuit Board