Patent Assignment
Reel/Frame 038900/0859
Assignment of Assignor's Interest
Recorded: 2016-06-13
Pages: 4
Assignors
YIU, HO-YIN
Executed: 2016-06-07
WEN, YING-NAN
Executed: 2016-06-07
LIU, CHIEN-HUNG
Executed: 2016-06-07
YANG, WEI-CHUNG
Executed: 2016-06-07
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Method for Forming Chip Package Having Chip Connected to Sensing Device with Redistribution Layer in Insulator Layer