Patent Assignment
Reel/Frame 038917/0846
Assignment of Assignor's Interest
Recorded: 2016-06-15
Pages: 17
Assignors
LAM, STEPHEN
Executed: 2016-04-21
CIPLICKAS, DENNIS
Executed: 2016-04-15
BROZEK, TOMASZ
Executed: 2016-04-20
CHENG, JEREMY
Executed: 2016-05-06
COMENSOLI, SIMONE
Executed: 2016-04-13
DE, INDRANIL
Executed: 2016-04-12
DOONG, KELVIN
Executed: 2016-04-28
EISENMANN, HANS
Executed: 2016-04-26
FISCUS, TIMOTHY
Executed: 2016-04-13
HAIGH, JONATHAN
Executed: 2016-04-13
HESS, CHRISTOPHER
Executed: 2016-04-12
KIBARIAN, JOHN
Executed: 2016-04-18
LEE, SHERRY
Executed: 2016-04-14
LIAO, MARCI
Executed: 2016-04-15
LIN, SHENG-CHE
Executed: 2016-04-28
MATSUHASHI, HIDEKI
Executed: 2016-04-25
MICHAELS, KIMON
Executed: 2016-04-18
O'SULLIVAN, CONOR
Executed: 2016-04-21
RAUSCHER, MARKUS
Executed: 2016-04-26
ROVNER, VYACHESLAV
Executed: 2016-04-13
STROJWAS, ANDRZEJ
Executed: 2016-04-28
STROJWAS, MARCIN
Executed: 2016-04-13
TAYLOR, CARL
Executed: 2016-04-13
VALLISHAYEE, RAKESH
Executed: 2016-04-12
WEILAND, LARG
Executed: 2016-04-21
YOKOYAMA, NOBUHARU
Executed: 2016-04-13
Assignee
PDF SOLUTIONS, INC.
333 W. SAN CARLOS ST., STE 1000, SAN JOSE, CALIFORNIA, 95110
Covered Properties
(3)
Integrated Circuit Containing DOEs of NCEM-enabled Fill Cells
Process for Making Semiconductor Dies, Chips, and Wafers Using In-Line Measurements Obtained From DOEs of NCEM-enabled Fill Cells
Patent:
10,593,604 →
Application:
15/090,267 →
Mesh-Style NCEM Pads, and Process for Making Semiconductor Dies, Chips, and Wafers Using In-Line Measurements from Such Pads
Patent:
9,805,994 →
Application:
15/090,274 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.