Patent Assignment
Reel/Frame 038935/0004
Assignment of Assignor's Interest
Recorded: 2016-06-16
Pages: 3
Assignors
LIN, TZU-HUNG
Executed: 2016-06-07
HSIAO, CHING-WEN
Executed: 2016-06-05
PENG, I-HSUAN
Executed: 2016-06-07
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Forming the Same