Patent Assignment
Reel/Frame 038965/0253
Assignment of Assignor's Interest
Recorded: 2016-06-21
Pages: 7
Assignors
LEE, DO-SUN
Executed: 2016-05-27
LEE, DO-HYUN
Executed: 2016-05-27
KIM, CHUL-SUNG
Executed: 2016-05-27
HYUN, SANG-JIN
Executed: 2016-06-13
LEE, JOON-GON
Executed: 2016-05-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Fabricating the Same