Patent Assignment
Reel/Frame 038975/0766
Assignment of Assignor's Interest
Recorded: 2016-06-21
Pages: 5
Assignor
SILICON LABORATORIES INC.
Executed: 2016-04-12
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Properties
(4)
Method for Temperature Compensation in Mems Resonators with Isolated Regions of Distinct Material
Methods And Structures For Thin-Film Encapsulation And Co-Integration Of Same With Microelectronic Devices and Microelectromechanical Systems (MEMS)
Membrane Transducer Structures And Methods Of Manufacturing Same Using Thin-Film Encapsulation
Trapped Sacrificial Structures and Methods of Manufacturing Same Using Thin-Film Encapsulation
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 23, 2013
From: BERNSTEIN, DAVID H.
To: SILICON LABORATORIES INC.
Reel/Frame 030477/0619 →
Assignment of Assignor's Interest
May 29, 2013
From: QUEVY, EMMANUEL P.
To: SILICON LABORATORIES INC.
Reel/Frame 030502/0050 →
Assignment of Assignor's Interest
Dec 2, 2014
From: QUEVY, EMMANUEL P.; HUI, JEREMY R.; LOW, CARRIE WING-ZIN
To: SILICON LABORATORIES
Reel/Frame 034309/0586 →
Assignment of Assignor's Interest
Dec 2, 2014
From: QUEVY, EMMANUEL P.; HUI, JEREMY R.; NERVEGNA, LOUIS
To: SILICON LABORATORIES INC.
Reel/Frame 034310/0640 →
Assignment of Assignor's Interest
Dec 4, 2014
From: QUEVY, EMMANUEL P.; HUI, JEREMY R.; LOW, CARRIE WING-ZIN; MOTIEE, MEHRNAZ
To: SILICON LABORATORIES INC.
Reel/Frame 034372/0613 →
Assignment of Assignor's Interest
Sep 20, 2016
From: SILICON LABORATORIES INC.
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 039805/0895 →