Patent Assignment
Reel/Frame 039805/0895
Assignment of Assignor's Interest
Recorded: 2016-09-20
Pages: 7
Assignor
SILICON LABORATORIES INC.
Executed: 2016-04-12
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Properties
(26)
Planar Microshells for Vacuum Encapsulated Devices and Damascene Method of Manufacture
Patent:
7,923,790 →
Application:
11/716,070 →
Method to Form a Mems Structure Having a Suspended Portion
Patent:
7,816,166 →
Application:
11/716,082 →
Method for Temperature Compensation in Mems Resonators with Isolated Regions of Distinct Material
Patent:
7,639,104 →
Application:
11/716,115 →
Microshells for Multi-Level Vacuum Cavities
Patent:
7,659,150 →
Application:
11/716,156 →
Mems Coupler and Method to Form the Same
Patent:
7,858,422 →
Application:
11/716,227 →
Ic-Compatible Mems Structure
Patent:
7,514,760 →
Application:
11/716,284 →
Encapsulated Mems Device and Method to Form the Same
Patent:
8,349,635 →
Application:
12/124,043 →
Out-Of-Plane Mems Resonator with Static Out-of-Plane Deflection
Patent:
7,999,635 →
Application:
12/182,082 →
Mems Structure Having a Stress-Inducer Temperature-Compensated Resonator Member
Patent:
7,944,124 →
Application:
12/201,819 →
Method for Temperature Compensation in Mems Resonators with Isolated Regions of Distinct Material
Mems coupler and method to form the same
Method for Temperature Compensation in Mems Resonators with Isolated Regions of Distinct Material
Planar Microshells for Vacuum Encapsulated Devices and Damascene Method of Manufacture
Microshells with Integrated Getter Layer
Planar Microshells for Vacuum Encapsulated Devices and Damascene Method of Manufacture
Technique for Forming a Mems Device
Patent:
8,852,984 →
Application:
13/075,800 →
Technique for Forming a Mems Device Using Island Structures
Patent:
8,877,536 →
Application:
13/075,806 →
Out-Of-Plane Mems Resonator with Static Out-of-Plane Deflection
Out-Of-Plane Resonator
Switchable Electrode for Power Handling
Out-Of-Plane Mems Resonator with Static Out-of-Plane Deflection
Method for Temperature Compensation in Mems Resonators with Isolated Regions of Distinct Material
Technique for Forming a Mems Device
Methods And Structures For Thin-Film Encapsulation And Co-Integration Of Same With Microelectronic Devices and Microelectromechanical Systems (MEMS)
Membrane Transducer Structures And Methods Of Manufacturing Same Using Thin-Film Encapsulation
Trapped Sacrificial Structures and Methods of Manufacturing Same Using Thin-Film Encapsulation
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 9, 2007
From: QUEVY, EMMANUEL P.; MONADGEMI, PEZHMAN; HOWE, ROGER T.
To: SILICON CLOCKS, INC.
Reel/Frame 019050/0268 →
Assignment of Assignor's Interest
Mar 9, 2007
From: QUEVY, EMMANUEL P.
To: SILICON CLOCKS, INC.
Reel/Frame 019053/0870 →
Assignment of Assignor's Interest
Mar 9, 2007
From: QUEVY, EMMANUEL P.; HOWE, ROGER T.
To: SILICON CLOCKS, INC.,
Reel/Frame 019051/0806 →
Assignment of Assignor's Interest
Mar 9, 2007
From: QUEVY, EMMANUEL P.
To: SILICON CLOCKS, INC.
Reel/Frame 019037/0681 →
Assignment of Assignor's Interest
Mar 9, 2007
From: QUEVY, EMMANUEL P.; BERNSTEIN, DAVID H.
To: SILICON CLOCKS, INC.
Reel/Frame 019037/0691 →
Assignment of Assignor's Interest
Mar 9, 2007
From: MONADGEMI, PEZHMAN; HOWE, ROGER T.; QUEVY, EMMANUEL P.
To: SILICON CLOCKS, INC.
Reel/Frame 019037/0684 →
Assignment of Assignor's Interest
Jun 13, 2008
From: GAN, QING; QUEVY, EMMANUEL P.
To: SILICON CLOCKS, INC.
Reel/Frame 021093/0097 →
Assignment of Assignor's Interest
Oct 17, 2008
From: QUEVY, EMMANUEL P.; BERNSTEIN, DAVID H.; MOTIEE, MEHRNAZ
To: SILICON CLOCKS, INC.
Reel/Frame 021700/0193 →
Assignment of Assignor's Interest
Feb 10, 2009
From: BERNSTEIN, DAVID H.
To: SILICON CLOCKS, INC.
Reel/Frame 022237/0208 →
Assignment of Assignor's Interest
May 4, 2010
From: QUEVY, EMMANUEL P.; BERNSTEIN, DAVID H.
To: SILICON CLOCKS, INC.
Reel/Frame 024370/0448 →
Change of Name
May 4, 2010
From: SILICON CLOCKS, INC.
To: SILICON LABS SC, INC.
Reel/Frame 024369/0134 →
Assignment of Assignor's Interest
Nov 16, 2010
From: SILICON LABS SC, INC.
To: SILICON LABORATORIES INC.
Reel/Frame 025366/0466 →
Assignment of Assignor's Interest
Jan 12, 2011
From: SILICON LABS SC, INC.
To: SILICON LABORATORIES INC.
Reel/Frame 025624/0190 →
Assignment of Assignor's Interest
Aug 16, 2011
From: QUEVY, EMMANUEL P.; LOW, CARRIE W.
To: SILICON LABORATORIES INC.
Reel/Frame 026754/0357 →
Assignment of Assignor's Interest
Aug 16, 2011
From: MOTIEE, MEHRNAZ; QUEVY, EMMANUEL P.; BERNSTEIN, DAVID H.
To: SILICON LABORATORIES INC.
Reel/Frame 026757/0589 →
Assignment of Assignor's Interest
Aug 16, 2011
From: QUEVY, EMMANUEL P.; LOW, CARRIE W.; HUI, JEREMY RYAN; GU, ZHEN
To: SILICON LABORATORIES INC.
Reel/Frame 026754/0326 →
Assignment of Assignor's Interest
Aug 19, 2011
From: QUEVY, EMMANUEL P.; SETH, MANU; MOTIEE, MEHRNAZ
To: SILICON LABORATORIES INC.
Reel/Frame 026778/0690 →
Assignment of Assignor's Interest
Oct 9, 2013
From: QUEVY, EMMANUEL P.; BERNSTEIN, DAVID H.
To: SILICON CLOCKS, INC.
Reel/Frame 031374/0913 →
Change of Name
Oct 9, 2013
From: SILICON CLOCKS, INC.
To: SILICON LABS SC, INC.
Reel/Frame 031374/0971 →
Corrective Assignment to Correct the Incorrect Patent No: Previously Recorded at Reel: 039805 Frame: 0895. Assignor(S) Hereby Confirms the Assignment.
Aug 2, 2019
From: SILICON LABORATORIES INC.
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 049949/0092 →