Patent Assignment
Reel/Frame 038987/0624
Assignment of Assignor's Interest
Recorded: 2016-06-22
Pages: 3
Assignor
WENG, CHAO-FU
Executed: 2015-10-19
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG, TAIWAN
Covered Property
(1)
Redistribution Layer Structure, Semiconductor Substrate Structure, Semiconductor Package Structure, Chip Structure, and Method of Manufacturing the Same