Patent Assignment
Reel/Frame 039005/0476
Assignment of Assignor's Interest
Recorded: 2016-06-24
Pages: 7
Assignors
HAN, JONG-WON
Executed: 2015-05-08
LEE, JONG-WOO
Executed: 2015-06-12
MIN, YOUNG-GI
Executed: 2015-04-28
LEE, SOON-WON
Executed: 2015-04-28
LEE, YONG-IN
Executed: 2015-04-27
Assignee
SAMSUNG ELECTRONICS CO.,LTD.
129, SAMSUNG-RO,YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Test Socket for Testing Semiconductor Chip Package and Method of Manufacturing the Same