IP Library › Assignment 039010/0269
Patent Assignment
Reel/Frame 039010/0269

Assignment of Assignor's Interest

Recorded: 2016-06-24 Pages: 6
Assignors
HSU, CHEN-KE
Executed: 2016-06-20
SHI, JUNPENG
Executed: 2016-06-20
CAI, PEI-SONG
Executed: 2016-06-20
LIN, ZHENDUAN
Executed: 2016-06-20
HUANG, HAO
Executed: 2016-06-20
LIAO, CHENJIE
Executed: 2016-06-20
CHAO, CHIH-WEI
Executed: 2016-06-20
LIN, QIUXIA
Executed: 2016-06-20
Assignee
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1721-1725, LVLING ROAD, SIMING DISTRICT, XIAMEN, 361009, CHINA
Covered Property (1)
Light Emitting Diode Package Structure and Fabrication Method
Patent: 9,966,514 →
Application: 15/192,993 →
Publication: US 2017/0005245
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 20, 2023
From: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065302/0223 →