Patent Assignment
Reel/Frame 065302/0223
Assignment of Assignor's Interest
Recorded: 2023-10-20
Pages: 10
Assignor
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Executed: 2023-09-19
Assignee
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
YUANQIAN VILLAGE, SHIJING TOWN, NANAN CITY, FUJIAN PROVINCE, QUANZHOU CITY, CHINA
Covered Properties
(123)
Light-Emitting Diode
Led Device
Nitride Underlayer and Fabrication Method Thereof
Nitride Underlayer and Fabrication Method Thereof
High-Voltage Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Semiconductor Element and Fabrication Method Thereof
Flip-chip Light Emitting Diode and Fabrication Method
Light-Emitting Diode Package
Patent:
768,095 →
Application:
29/541,826 →
Light Emitting Diode and Fabrication Method Thereof
Package for Light-Emitting Diode
Patent:
761,215 →
Application:
29/526,628 →
Light-Emitting Diode Package
Patent:
756,942 →
Application:
29/526,620 →
Nitride Light Emitting Diode and Fabrication Method Thereof
Flip-Chip High-Voltage Light Emitting Device and Fabrication Method
Package Support, Fabrication Method and Led Package
Package Support, Fabrication Method and Led Package
Package Support, Fabrication Method and Led Package
Flip-chip Light Emitting Device and Fabrication Method
Fabrication Method of Nitride Light Emitting Diodes
Light-Emitting Device
Light Emitting Diode
High-Brightness Light-Emitting Diode with Surface Microstructures
Flip-Chip Led with Barrier Structure
Multiple Quantum Well Structure and Light Emitting Diodes
Integrated Led Light-Emitting Device and Fabrication Method Thereof
Led Epitaxial Structure and Fabrication Method Thereof
Light Emitting Diode Packaging Structure
Nitride Light Emitting Diode and Fabrication Method Thereof
Nitride Underlayer and Fabrication Method Thereof
Double-Sided LED and Fabrication Method Thereof
Light-Emitting Diode and Fabrication Method Thereof
Light-Emitting Diode and Fabrication Method Thereof
Nitride Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
GaN-Based LED
GaN-Based LED
Gallium-Nitride-Based Light Emitting Diodes with Multiple Potential Barriers
Light Emitting Device and Light Emitting Apparatus
Light-Emitting Diode Chip, Device, and Lamp
Light-Emitting Diode and Method for Manufacturing the Same
Light-Emitting Diode Device and White Light Emitting System
Light-Emitting Diode Device
Uv Led Device
Laser Device and Light Guide Member Used with the Same
White Light Led Package Structure and White Light Source System
Light Emitting Diode and Method of Fabricating the Same
Flip-chip Light Emitting Diode Chip and Fabrication Method
Flip-chip Light Emitting Diode Chip and Fabrication Method
Light Emitting Diode
Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Bonding Electrode Structure of Flip-Chip Led Chip and Fabrication Method
Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Nitride Underlayer and Fabrication Method Thereof
Fabrication Method of Vertical Light-Emitting Diode
Light Emitting Diode Chip and Fabrication Method
Light Emitting Diode Chip and Fabrication Method
Light Emitting Diode and Fabrication Method Thereof
Patterned Sapphire Substrate, Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Nitride White-light Light-Emitting Diode
Light-Emitting Diode
Light Emitting Diode and Fabrication Method Thereof
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip
Semiconductor Element and Fabrication Method Thereof
Light Emitting Diode Package Structure and Fabrication Method
Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Light Emitting Diode and Fabrication Method Thereof
Patterned Sapphire Substrate and Light Emitting Diode
Method for Manufacturing a Light Emitting Element
Four-Element Light Emitting Diode with Transparent Substrate and Preparation Method
LED Structure and Fabrication Method
Light Emitting Diode Chip and Fabrication Method
Light Emitting Diode Chip and Fabrication Method
Nitride Light-Emitting Diode
Integrated LED Light-Emitting Device and Fabrication Method Thereof
Surface-Mounted Light-Emitting Device and Fabrication Method Thereof
Surface-Mounted Light-Emitting Device and Fabrication Method Thereof
Light-Emitting Device and Fabrication Method Thereof
Light Emitting Diode Packaging Structure
Led for Plant Illumination
Led for Plant Illumination
Led for Plant Illumination
Graphite Wafer Carrier for LED Epitaxial Wafer Processes
Light Emitting Diode Fabrication Method
Flip-Chip Light Emitting Diode and Fabrication Method
Light-Emitting Diode and Fabrication Method Thereof
Light-Emitting Device with Reflecting Electrode
GaN-based Light Emitting Diode with Current Spreading Structure
Semiconductor Light-Emitting Device Preventing Metal Migration
Vertical Light Emitting Diode and Fabrication Method
Warm White LED with Stacked Wafers and Fabrication Method Thereof
Flip-Chip Light Emitting Diode and Fabrication Method
Ultraviolet Semiconductor Light-Emitting Device and Fabrication Method
Led with Current Spreading Layer and Fabrication Method
Vertical Type AC-LED Device and Manufacturing Method Thereof
Vertical Light Emitting Device and Manufacturing Method Thereof
Light Emitting Diode and Manufacturing Method Therefor
Alternating Current Vertical Light Emitting Element and Manufacturing Method Thereof
Light Emitting Devices, Systems, and Methods of Manufacturing
Light Emitting Devices, Systems, and Methods of Manufacturing
Light Emitting Diode Having Increased Light Extraction
Method for Lift-Off of Light-Emitting Diode Substrate
Nitride Light-Emitting Diode with a Current Spreading Layer
Light Emitting Diode with a Current Concentrating Structure
Light Emitting Diode with a Current Concentrating Structure
Reflector, Manufacture Method Thereof and Light-Emitting Device Including the Reflector
Algainp Light-Emitting Diode Having Vertical Structure with Transparent Multilayerd Reflective Films
Gan-Based Light-Emitting Diode and Method for Manufacturing the Same
Vertical Light-Emitting Diode
Algainp-Based Light-Emitting Diode with Double Reflective Layers and Fabrication Method Thereof
Method for Manufacturing Gan-Based Film Led
Antistatic Gallium Nitride Based Light Emitting Device and Method for Fabricating the Same
Light-Emitting Diode Device and Method for Manufacturing the Same
Light-Emitting Diode and Manufacturing Method Therefor
Light Emitting Diode Device
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 27, 2015
From: SHI, JUN-PENG; CAI, PEI-SONG; HUANG, HAO; LIANG, XING-HUA
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 034816/0168 →
Assignment of Assignor's Interest
May 12, 2015
From: SHI, JUNPENG; CAI, PEI-SONG; LIN, ZHENDUAN; HUANG, HAO
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 035617/0016 →
Assignment of Assignor's Interest
May 12, 2015
From: SHI, JUNPENG; CAI, PEI-SONG; LIN, ZHENDUAN; HUANG, HAO
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 035616/0289 →
Assignment of Assignor's Interest
Oct 8, 2015
From: SHI, JUNPENG; CAI, PEI-SONG; LIN, ZHENDUAN; HUANG, HAO
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 036757/0416 →
Assignment of Assignor's Interest
Aug 9, 2016
From: SHI, JUN-PENG; CAI, PEI-SONG; HUANG, HAO; LIANG, XING-HUA
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 039387/0339 →
Assignment of Assignor's Interest
Jan 27, 2017
From: ZHONG, ZHIBAI; LIN, WEN-YU; CHIANG, YEN-CHIH; LIU, JIANMING
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 041098/0674 →
Assignment of Assignor's Interest
Jan 29, 2017
From: ZHONG, ZHIBAI; CHIANG, YEN-CHIH; FANG, QIUYAN; LEE, CHIA-EN
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 041114/0513 →
Assignment of Assignor's Interest
May 27, 2017
From: CHANG, CHIA-HUNG; CHEN, GONG; LIN, SU-HUI; PENG, KANG-WEI
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 042520/0720 →
Assignment of Assignor's Interest
May 28, 2017
From: XU, ZHIBO; CHOU, SHENG-WEI; CHENG, CHIH-CHING; WANG, XIAO
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 042520/0837 →
Assignment of Assignor's Interest
Jun 13, 2017
From: SHI, JUN-PENG; CAI, PEI-SONG; HUANG, HAO; LIANG, XING-HUA
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 042693/0735 →
Assignment of Assignor's Interest
Jul 13, 2017
From: HSIEH, HSIANG-PIN; SONG, CHANGWEI; CHANG, CHIA-HUNG; LING, CHAN-CHAN
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 043003/0450 →
Assignment of Assignor's Interest
Oct 3, 2017
From: ZHANG, JIE; ZHU, XUELIANG; DU, CHENGXIAO; LIU, JIANMING
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 043769/0267 →
Assignment of Assignor's Interest
Nov 12, 2017
From: ZHENG, GAOLIN; HONG, LING-YUAN; LIN, XIAOXIONG; WANG, FENG
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 044099/0020 →
Assignment of Assignor's Interest
Dec 18, 2017
From: HE, ANHE; LIN, SU-HUI; ZHENG, JIANSEN; PENG, KANG-WEI
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 044426/0929 →
Assignment of Assignor's Interest
Dec 30, 2017
From: CHEN, SHENGCHANG; LIN, WEN-YU; ZHANG, JIE; DENG, HEQING
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 044509/0837 →
Assignment of Assignor's Interest
Sep 27, 2018
From: YE, DA-QIAN; ZHANG, DONGYAN; WU, CHAOYU; WANG, DUXIANG
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 047000/0780 →
Assignment of Assignor's Interest
Sep 30, 2018
From: LI, XING-LONG; LIAO, CHI-WEI; HSU, CHEN-KE; WONG, WENG TACK
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 047014/0095 →
Assignment of Assignor's Interest
Sep 30, 2018
From: ZHENG, GAOLIN; WU, HOU-JUN; HE, ANHE; LIU, SHIWEI
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 047014/0062 →