Flip-chip light emitting device and fabrication method
A flip-chip light emitting device includes: a light-emitting epitaxial laminated layer with two opposite surfaces, in which, the first surface is a light-emitting surface; a first electrode and a second electrode that are separated from each other on the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with two opposite surfaces and two side walls connecting those two surfaces, in which, the first surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; a first external electrode and a second external electrode on the second surface of the non-conductive substrate, which extend to the side walls of the non-conductive substrate till and at least cover parts of the side walls of the first and the second electrodes to form electrical connection.
1. A flip-chip light emitting device, comprising: a light-emitting epitaxial laminated layer with a first and a second opposing surfaces, wherein the first surface is a light-emitting surface; a first electrode and a second electrode separated from each other disposed over and directly connecting the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with a first and a second opposing substrate surfaces and two side surfaces connecting the first and second substrate surfaces, wherein the first substrate surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; and a first external electrode and a second external electrode over the second substrate surface extending to the two side surfaces of the non-conductive substrate and at least covering portions of side walls of the first and the second electrodes to form electrical connection, wherein: a thinned single crystal substrate on the light-emitting epitaxial laminated layer and edges of the thinned single crystal substrate extend beyond edges of the light-emitting epitaxial laminated layer.
2. The flip-chip light emitting device of claim 1 , wherein: edges of the first and the second electrodes extend beyond the edges of the light-emitting epitaxial laminated layer.
3. The flip-chip light emitting device of claim 1 , wherein: edges of the first and the second electrodes extend beyond the edges of the light-emitting epitaxial laminated layer by 30 μm or above, to thereby avoid short circuit of side walls of the light-emitting epitaxial laminated layer during fabrication of the first and the second external electrodes.
4. The flip-chip light emitting device of claim 1 , wherein: a space between the first and the second electrodes is 40 μm-150 μm.
5. The flip-chip light emitting device of claim 1 , wherein: the first and the second electrodes have an equal height.
6. The flip-chip light emitting device of claim 1 , wherein: a plating seed layer is formed between the non-conductive substrate and the first and the second external electrodes and extends from the second substrate surface to the two side surfaces of the non-conductive substrate.
7. The flip-chip light emitting device of claim 6 , wherein: the first and the second external electrodes are electroplated over the plating seed layer.
8. A light-emitting system comprising a plurality of light-emitting devices, each light-emitting device comprising: a light-emitting epitaxial laminated layer with a first and a second opposing surfaces, wherein the first surface is a light-emitting surface; a first electrode and a second electrode separated from each other disposed over and directly connecting the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with a first and a second opposing substrate surfaces and two side surfaces connecting the first and second substrate surfaces, wherein the first substrate surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; and a first external electrode and a second external electrode over the second substrate surface extending to the two side surfaces of the non-conductive substrate and at least covering portions of side walls of the first and the second electrodes to form electrical connection, wherein: a thinned single crystal substrate on the light-emitting epitaxial laminated layer and edges of the thinned single crystal substrate extend beyond edges of the light-emitting epitaxial laminated layer.
9. The light-emitting system of claim 8 , wherein: edges of the first and the second electrodes extend beyond the edges of the light-emitting epitaxial laminated layer.
10. The light-emitting system of claim 8 , wherein: edges of the first and the second electrodes extend beyond the edges of the light-emitting epitaxial laminated layer by 30 μm or above, to thereby avoid short circuit of side walls of the light-emitting epitaxial laminated layer during fabrication of the first and the second external electrodes.
11. The light-emitting system of claim 8 , wherein: a space between the first and the second electrodes is 40 μm-150 μm.
12. The light-emitting system of claim 11 , wherein: the first and the second electrodes have an equal height; a plating seed layer is formed between the non-conductive substrate and the first and the second external electrodes and extends from the second substrate surface to the two side surfaces of the non-conductive substrate; and the first and the second external electrodes are electroplated over the plating seed layer.