Light emitting devices, systems, and methods of manufacturing

1. A light emitting device comprising:

a substrate;

an n layer;

an active light emitting region,

a p layer;

a support portion configured to provide both mechanical support and improve light transmission disposed over a light emitting side of the device;

a submount over a side of the active light emitting region opposite a side of the substrate, wherein the submount includes a plurality of conductive vias;

a contact layer;

a conductive layer; and

a reflective contact layer opposite to the light emitting side;

wherein the support portion is formed by thinning the substrate.

2. The light emitting device of claim 1 , wherein an area of the plurality of conductive vias has a fraction of less than 60% of a total surface area of the submount.

3. The light emitting device of claim 2 , further comprising a bonding layer over a surface of the submount.

4. The light emitting device of claim 3 , wherein the bonding layer includes a portion having an electrical resistivity in a range of 1.0×10 −8 to 1.0×10 −4 Ω·m.

5. The light emitting device of claim 4 , wherein the bonding layer has a melting point above 200° C.

6. The light emitting device of claim 1 , wherein the conductive layer includes a portion having an electrical resistivity in a range of 1.0×10 −8 to 1.0×10 −4 Ω·m.

7. The light emitting device of claim 1 , further comprising a reflector metal contact comprising one or more layers of Al, Ag, Pt, or Au.

8. The light emitting device of claim 1 , further comprising a contacting metal layer comprising a combination of one or more layers of Cr, Ti, Pt, Au, Al, Ni, Pd, and Ge.

9. The light emitting device of claim 1 , wherein the support portion includes a plurality of conductive channels configured to electrically couple the device to an external power source.

10. The light emitting device of claim 1 , wherein an area of the plurality of conductive vias is a fraction of less than 40% of a total surface area of the submount so as to maintain a substantial mechanical strength of the device.

11. The light emitting device of claim 9 , wherein the support portion has a thickness of not less than 15 microns.

12. The light emitting device of claim 9 , wherein the support portion has an array of blind vias forming an optical functional surface to improve light output.

13. The light emitting device of claim 12 , wherein the blind vias have a depth less than half a thickness of the support portion so as to maintain a substantial mechanical strength of the support portion.

14. The light emitting device of claim 12 , wherein the blind vias have a surface area less than 60% of a total surface area of the support portion.

15. The light emitting device of claim 1 , further comprising:

a reflector opposite the light emitting side; and

a plurality of microchannels configured to optically couple the active light emitting region and the reflector.

16. A method of manufacturing a light emitting device,

wherein the device comprises:

a substrate;

an n layer;

an active light emitting region,

a p layer;

a support portion configured to provide both mechanical support and improve light transmission disposed over a light emitting side of the device;

a submount over a side of the active light emitting region opposite a side of the substrate, wherein the submount includes a plurality of conductive vias; a contact layer;

a conductive layer; and

a reflective contact layer opposite to the light emitting side;

wherein the method comprises:

providing the substrate, the n layer, the active light emitting region, the p layer; the support portion configured to provide both mechanical support and improve light transmission disposed over the light emitting side of the device, the submount over the side of the active light emitting region opposite the side of the substrate, wherein the submount includes the plurality of conductive vias, the contact layer, the conductive layer, and the reflective contact layer opposite to the light emitting side; and

thinning the substrate to form the support portion.

17. The method of claim 16 , wherein the device further comprises a reflector, the method further comprising:

forming a plurality of microchannels in one or more UV-absorbing layers to improve optical coupling between the one or more UV-absorbing layers to the reflector,

wherein the one or more UV-absorbing layers include at least one of the n layer or the p layer.

18. The method of claim 16 , further comprising:

bonding the substrate, the n layer, the active light emitting region, and the p layer with the submount; and

forming a plurality of blind and through vias in the thinned substrate.