IP Library Granted Patent US 8,415,702
Granted Patent B2
US 8,415,702 · App. 13/233,367 · Granted Apr 9, 2013

Reflector, manufacture method thereof and light-emitting device including the reflector

Inventors: Qunfeng Pan (Xiamen, CN); Jyh-Chiarng Wu (Xiamen, CN); Kechuang Lin (Xiamen, CN)
Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,415,702
App. No.
13/233,367
Granted
Apr 9, 2013
Kind
B2
Abstract

A reflector for a GaN-based light-emitting device, method for manufacturing the reflector and GaN-based light-emitting device including the reflector are provided. The reflector is formed on a p-type GaN-based epitaxial layer and includes: a whisker crystal of un-doped GaN, formed on a surface of the p-type GaN-based epitaxial layer with a predefined density distribution and at a position that corresponds to a dislocation defect of an epitaxial layer; and a metal reflective layer, formed on both the p-type GaN-based epitaxial layer and the whisker crystal. The whisker of un-doped GaN is positioned on the dislocation defect of the p-type GaN-based epitaxial layer, so that the Ag reflective layer can be separated from the dislocation defect of the p-type GaN-based epitaxial layer, thereby effectively preventing Ag from moving inside the dislocation defect via electromigration, and largely decreasing the possibility of current leakage of the light-emitting device including the Ag reflector.

Claims (9)

1. A reflector for a GaN-based light-emitting device, wherein the reflector is formed on a p-type GaN-based epitaxial layer and comprises:

a whisker crystal of un-doped GaN, formed on a surface of the p-type GaN-based epitaxial layer with a predefined density distribution and at a position that corresponds to a dislocation defect of an epitaxial layer wherein the epitaxial layer comprises the p-type GaN-based epitaxial, layer; and

a metal reflective layer, formed on both the p-type GaN-based epitaxial layer and the whisker crystal.

2. The reflector according to claim 1 , wherein the metal reflective layer comprises Ag, an Ag alloy, or a combination thereof.

3. A GaN-based light-emitting device, comprising:

an epitaxial structure comprising an n-type GaN-based epitaxial layer, an active layer and a p-type GaN-based epitaxial layer; and a p-type reflector at the side of the p-type GaN-based epitaxial layer, wherein the p-type reflector comprises:

a whisker crystal of un-doped GaN, formed on a surface of the p-type GaN-based epitaxial layer with a predefined density distribution and at, a position that corresponds to a dislocation defect of the epitaxial structure; and

a metal reflective layer, formed on both the p-type GaN-based epitaxial layer and the whisker crystal.

4. The GaN-based light-emitting device according to, claim 3 , wherein the metal reflective layer comprises Ag, an Ag alloy, or a combination thereof.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2023
From: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065302/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2011
From: PAN, QUNFENG; WU, JYH-CHIARNG; LIN, KECHUANG
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 026911/0946 →
Priority Claims (1)
CN 2010 1 0523518 · Oct 29, 2010 · national
Continuity (1)
Related Publication 20120104410A1 · May 3, 2012