Package support, fabrication method and LED package
A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.
1. A light-emitting diode (LED) package, comprising:
a substrate with front and back surfaces, including:
at least two metal blocks;
an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and
an electrical insulation region between the at least two metal blocks;
an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and
a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate;
wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate; and
wherein the electrical insulation has an “I” or “H” shape.
2. The LED package of claim 1 , wherein the at least two metal blocks are configured for electrical conduction and heat dissipation, and include two metal blocks disposed with an axial symmetric configuration.
3. The LED package of claim 1 , wherein the at least two metal blocks include two metal blocks disposed with a rotational symmetric configuration at 180°.
4. A light-emitting diode (LED) package, comprising:
a substrate with front and back surfaces, including:
at least two metal blocks;
an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and
an electrical insulation region between the at least two metal blocks;
an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and
a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate;
wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate; and
wherein the electrical insulation has an “S” or inverted-“S” shape, and wherein each metal block has at least three protrusion connection portions.
5. The LED package of claim 1 , wherein at least one protrusion connection portion has an angle of inclination with respect to a corresponding metal block.
6. The LED package of claim 1 , wherein the at least two metal blocks form a snug coupling with the insulation portion at a vertical direction.
7. A light-emitting diode (LED) package, comprising:
a substrate with front and back surfaces, including:
at least two metal blocks;
an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and
an electrical insulation region between the at least two metal blocks;
an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and
a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate;
wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate; and
wherein:
the at least two metal blocks include an upper portion and a lower portion at a vertical direction;
the upper portion is at a front surface of the substrate and the lower portion is at a back surface of the substrate; and
the upper portion and the lower portion have different shapes.
8. The LED package of claim 7 , wherein:
at least a portion of the upper portion of the at least two metal blocks horizontally protrudes relative to the lower portion; and
at least a portion of the lower portion of the at least two metal block horizontally protrudes relative to the upper portion.
9. The LED package of claim 7 , wherein the protrusion connection portion is at the upper portion or the lower portion of the at least two metal blocks.
10. The LED package of claim 1 , wherein the package encapsulant has a thickness of about 0.2-5 mm.
11. The LED package of claim 1 , wherein the package encapsulant has a thickness of about 0.2-3 mm.
12. The LED package of claim 1 , wherein the package encapsulant has a thickness of about 0.5-5 mm to thereby increase a light-emitting angle of the LED package.
13. A light-emitting diode (LED) package, comprising:
a substrate with front and back surfaces, including:
at least two metal blocks;
an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and
an electrical insulation region between the at least two metal blocks;
an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and
a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate;
wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate; and
wherein the package encapsulant has an arc shape at a light-emitting side to thereby increase a light-emitting angle of the LED package.
14. A light-emitting diode (LED) package, comprising:
a substrate with front and back surfaces, including:
at least two metal blocks;
an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and
an electrical insulation region between the at least two metal blocks;
an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and
a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate;
wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate;
the LED package further comprising a wavelength conversion portion.
15. The LED package of claim 14 , wherein the wavelength conversion portion is disposed in the package encapsulant.
16. The LED package of claim 14 , wherein the wavelength conversion portion comprises a wavelength conversion material layer disposed over the package encapsulant.
17. A light-emitting system comprising a plurality of LED packages, each LED package including
a substrate with front and back surfaces, including:
at least two metal blocks;
an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and
an electrical insulation region between the at least two metal blocks;
an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and
a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate;
wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate; and
wherein the metal blocks include front frames and back frames vertically stacked together, and the back frames are connected together having an area larger than an area of the front frames.
18. A light-emitting system comprising a plurality of LED packages, each LED package including
a substrate with front and back surfaces, including:
at least two metal blocks;
an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and
an electrical insulation region between the at least two metal blocks;
an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and
a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate;
wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate; and
wherein the front and back surfaces of the substrate are substantially flat to thereby realize a wider light-emitting angle and higher light-emitting efficiency.