Granted Patent
S1
US 768,095 · App. 29/541,826 · Granted Oct 4, 2016
Light-emitting diode package
Inventors:
Junpeng Shi (Xiamen, CN); Pei-Song Cai (Xiamen, CN); Zhenduan Lin (Xiamen, CN); Hao Huang (Xiamen, CN)
View Patent ↗
Loading inventors, assignments & file history…
Claims (1)
The ornamental design for a light-emitting diode package, substantially as shown and described.
Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Oct 20, 2023
From: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065302/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Oct 8, 2015
From: SHI, JUNPENG; CAI, PEI-SONG; LIN, ZHENDUAN; HUANG, HAO
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 036757/0416 →