Graphite wafer carrier for LED epitaxial wafer processes
View Patent ↗A graphite wafer carrier for LED epitaxial wafer processes, having a plurality of wafer pocket profiles above the carrier for carrying the epitaxial wafer substrate. The inner edge of the wafer pocket profile is a concave step with a plurality of inward-extended support portions; and also has a graphite wafer carrier edge and an axle hole at the center of the graphite wafer carrier. The pocket profiles of different quantities and sizes can be arranged on the basis of different process parameters. The disclosed structure can reduce or eliminate airflow interference and improve the wafer edge yield.
1. A graphite wafer carrier for LED epitaxy process, wherein the graphite wafer carrier has a plurality of indentations at an upper surface of the carrier configured to carry an epitaxial wafer substrate, wherein an inner edge of the indentations is a concave step with a plurality of inward-extended support portions protruding from the inner edge and having a protrusion width L of a wafer pocket profile underneath the wafer and a step width W of the wafer pocket profile underneath the wafer, wherein W is also a width of an undercut of each of the inward-extended support portions.
2. The graphite wafer carrier of claim 1 , wherein the inner edge is configured to reduce airflow interference and improve wafer edge yield during epitaxial growth.
3. The graphite wafer carrier of claim 1 , wherein a diameter D1 of the wafer substrate diameter and an inner diameter D2 of the step has a relationship of 0≦D1−D2<0.06 mm.
4. The graphite wafer carrier of claim 1 , wherein the step has a width of about 0.2 mm-1.5 mm.
5. The graphite wafer carrier of claim 4 , wherein: the step width is about 0.2 mm-0.5 mm.
6. The graphite wafer carrier of claim 1 , wherein the support portions comprise periodically-distributed protrusions.
7. The graphite wafer carrier of claim 6 , wherein: the protrusions have a width of about 0.2 mm-0.5 mm.
8. The graphite wafer carrier of claim 7 , wherein the step has a height the same with a height of the protrusions.
9. The graphite wafer carrier of claim 6 , wherein the step has a height the same with a height of the protrusions.
10. The graphite wafer carrier of claim 1 , wherein the indentations have a bottom that is a flat surface, a convex surface, or a concave surface.
11. A method for an LED epitaxial wafer processes, comprising:
carrying an epitaxial wafer substrate using a graphite wafer carrier;
wherein the graphite wafer carrier has a plurality of indentations at an upper surface of the carrier configured to carry the epitaxial wafer substrate;
wherein an inner edge of the indentations is a concave step with a plurality of inward-extended support portions protruding from the inner edge and having a protrusion width L of a wafer pocket profile underneath the wafer and a step width W of the wafer pocket profile underneath the wafer, wherein W is also a width of an undercut of each of the inward-extended support portions, configured to reduce airflow interference and improve a wafer edge yield.
12. The method of claim 11 , wherein a diameter D1 of the wafer substrate diameter and an inner diameter D2 of the step has a relationship of 0≦D1−D2<0.06 mm.
13. The method of claim 11 , wherein the step has a width of about 0.2 mm-1.5 mm.
14. The method of claim 13 , wherein: the step width is about 0.2 mm-0.5 mm.
15. The method of claim 11 , wherein the support portions comprise periodically-distributed protrusions.
16. The method of claim 15 , wherein the protrusions have a width of about 0.2 mm-0.5 mm.
17. The method of claim 16 , wherein the step has a height the same with a height of the protrusions.
18. The method of claim 15 , wherein the step has a height the same with a height of the protrusions.
19. The method of claim 11 , wherein the indentations have a bottom that is a flat surface, a convex surface, or a concave surface.
20. An MOCVD system comprising one or more graphite wafer carriers for LED epitaxial processing, wherein the graphite wafer carrier has a plurality of indentations at an upper surface of the carrier configured to carry an epitaxial wafer substrate, wherein an inner edge of the indentations is a concave step with a plurality of inward-extended support portions protruding from the inner edge and having a protrusion width L of a wafer pocket profile underneath the wafer and a step width W of the wafer pocket profile underneath the wafer, wherein W is also a width of an undercut of each of the inward-extended support portions.