Patent Assignment
Reel/Frame 039019/0689
Assignment of Assignor's Interest
Recorded: 2016-06-27
Pages: 6
Assignors
CHUNG, WON-KEUN
Executed: 2016-06-13
LEE, HU-YONG
Executed: 2016-06-13
JEON, TAEK-SOO
Executed: 2016-06-13
HYUN, SANG-JIN
Executed: 2016-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same