Patent Assignment
Reel/Frame 039045/0425
Assignment of Assignor's Interest
Recorded: 2016-06-29
Pages: 4
Assignors
CHEN, SHING-CHAO
Executed: 2016-06-02
LIN, CHIH-WEI
Executed: 2016-06-02
CHEN, MENG-TSE
Executed: 2016-06-02
HUANG, HUI-MIN
Executed: 2016-06-03
CHENG, MING-DA
Executed: 2016-06-03
PAN, KUO-LUNG
Executed: 2016-06-13
CHANG, WEI-SEN
Executed: 2016-06-13
KUO, TIN-HAO
Executed: 2016-06-13
TSAI, HAO-YI
Executed: 2016-06-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package with Fan-Out Structure