IP Library Assignment 039047/0005
Patent Assignment
Reel/Frame 039047/0005

Assignment of Assignor's Interest

Recorded: 2016-06-29 Pages: 3
Assignor
SHOJAIE, SAEED S.
Executed: 2016-06-15
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Multichip Packaging for Dice of Different Sizes
Application: 15/197,494 →
Publication: US 2018/0005990
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072915/0744 →