Patent Assignment
Reel/Frame 072915/0744
Assignment of Assignor's Interest
Recorded: 2025-09-17
Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(25)
Method and Apparatus to Enable Individual Non Volatile Memory Express (Nvme) Input/Output (Io) Queues on Differing Network Addresses of an Nvme Controller
Apparatus and Method for Multi-Bit Error Detection and Correction
Technologies for Securing a Firmware Update
Computer Program Product, System, and Method for Dynamically Increasing the Capacity of a Storage Device
Module Stacking Mechanism with Integrated Ground
Multichip Packaging for Dice of Different Sizes
Technologies for Addressing Data in a Memory
Method and Apparatus to Provide Both Storage Mode and Memory Mode Access to Non-Volatile Memory Within a Solid State Drive
Methods and Apparatus to Read from a Nonvolatile Memory Device
Hybrid Scheduling and Latch-Based Pipelines for Low-Density Parity-Check Decoding
Apparatus and Method for Single Temperature Subthreshold Factor Trimming for Hybrid Thermal Sensor
Liquid Coolant Based Thermal Energy Management for Containers Receiving Pluggable Circuit Modules
Integrated Circuit Structures in Package Substrates
Inductor and Transmission Line with Air Gap
Self-Aligned Repeatedly Stackable 3D Vertical Rram
High Density Multiple Die Structure
Asymmetric Transmission (Tx) and Receive (Rx) Lanes in a Point-to-Point Interconnect Using a Peripheral Component Interconnect Express (Pcie) Resources in a Computer System
Magnetoelectric Spin Orbit Logic Based Minority Gate
Magnetoelectric Spin Orbit Logic Based Full Adder
Management of Guardianship of an Entity Including via Elastic Boundaries
Electronic Device Packages and Methods for Maximizing Electrical Current to Dies and Minimizing Bond Finger Size
METHOD AND APPARATUS TO ENABLE INDIVIDUAL NON VOLATILE MEMORY EXPRESS (NVMe) INPUT/OUTPUT (IO) QUEUES ON DIFFERING NETWORK ADDRESSES OF AN NVMe CONTROLLER
Integrated Circuit Structures in Package Substrates
Buried Electrical Debug Access Port
High Capacity External Storage Drive
Patent:
801,334 →
Application:
29/505,659 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 21, 2015
From: FREYENSEE, JAMES P.; CAYTON, PHIL C.; MINTURN, DAVE B.; STERNBERG, JAY E.
To: INTEL CORPORATION
Reel/Frame 037344/0506 →
Assignment of Assignor's Interest
May 2, 2016
From: ADAMS, NICHOLAS J.; NARASIMHAN, KRISHNAKUMAR; ZIMMER, VINCENT J.
To: INTEL CORPORATION
Reel/Frame 038433/0805 →
Assignment of Assignor's Interest
May 24, 2016
From: TATE, ALAN W.; THOMPSON, ANDREW F.
To: INTEL CORPORATION
Reel/Frame 038803/0073 →
Assignment of Assignor's Interest
Jun 29, 2016
From: SHOJAIE, SAEED S.
To: INTEL CORPORATION
Reel/Frame 039047/0005 →
Assignment of Assignor's Interest
Jul 1, 2016
From: HADY, FRANK
To: INTEL CORPORATION
Reel/Frame 039240/0963 →
Assignment of Assignor's Interest
Jul 5, 2016
From: KHAN, JAWAD B.; GOPAL, VINODH; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 039075/0158 →
Assignment of Assignor's Interest
Jul 12, 2016
From: GARCIA, ROWEL S.; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 039315/0750 →
Assignment of Assignor's Interest
Oct 12, 2016
From: THAKUR, SACHIN
To: INTEL IP CORPORATION
Reel/Frame 040332/0891 →
Assignment of Assignor's Interest
Dec 12, 2016
From: WU, WEI; HICKMANN, BRIAN J.; BRADFORD, DENNIS R.
To: INTEL CORPORATION
Reel/Frame 040716/0495 →
Assignment of Assignor's Interest
Feb 8, 2018
From: LU, CHO-YING; LEE, HYUNG-JIN
To: INTEL CORPORATION
Reel/Frame 044870/0737 →
Assignment of Assignor's Interest
Mar 6, 2018
From: CHEN, ANNIE; RODRIGUEZ, DAVID; FANEUF, BARRETT M.; CEVALLOS, JUAN G.
To: INTEL CORPORATION
Reel/Frame 045123/0262 →
Assignment of Assignor's Interest
Apr 3, 2018
From: GANESAN, SANKA; LAMBERT, WILLIAM JAMES; ZHANG, ZHICHAO; CHAVALI, SRI CHAITRA JYOTSNA
To: INTEL CORPORATION
Reel/Frame 045429/0151 →
Assignment of Assignor's Interest
Dec 10, 2018
From: LI, ZHIMING; RUAN, XINGPING; HU, XIAO; TRAUSCH, TERRENCE
To: INTEL CORPORATION
Reel/Frame 047731/0813 →
Assignment of Assignor's Interest
Feb 21, 2019
From: LIN, KEVIN
To: INTEL CORPORATION
Reel/Frame 048401/0179 →
Assignment of Assignor's Interest
Mar 6, 2019
From: SATO, NORIYUKI; O'BRIEN, KEVIN; HAN, EUNGNAK; CHANDHOK, MANISH
To: INTEL CORPORATION
Reel/Frame 048518/0814 →
Assignment of Assignor's Interest
Aug 1, 2019
From: CHEN, CHIA-HSIANG; TANG, WEI; SHEIKH, FARHANA
To: INTEL CORPORATION
Reel/Frame 049924/0289 →
Assignment of Assignor's Interest
Jun 9, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 057254/0415 →
Assignment of Assignor's Interest
Aug 3, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 057061/0001 →