Integrated circuit structures in package substrates
Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
1. A conductive structure in an integrated circuit (IC) package substrate, comprising:
two vertical conductive walls, wherein the two vertical conductive walls each include at least one via and at least one pad, the vias and pads of an individual vertical conductive wall are distributed in a vertical direction relative to each other, and the at least one via has a rectangular footprint;
two horizontal conductive walls, wherein the two vertical conductive walls are both in conductive contact with the two horizontal conductive walls; and
a conductive portion, wherein the conductive portion is between the two vertical conductive walls and between the two horizontal conductive walls, and the conductive portion and the horizontal conductive walls are distributed in a vertical direction relative to each other.
2. The conductive structure of claim 1 , wherein the conductive portion is between corresponding pads of the two vertical conductive walls.
3. The conductive structure of claim 1 , wherein the conductive portion is one of a plurality of conductive portions arranged in an array, and the two vertical conductive walls are two of a plurality of vertical conductive walls arranged with a conductive portion between adjacent ones of the vertical conductive walls.
4. The conductive structure of claim 1 , further comprising:
a dielectric material between the vertical conductive walls.
5. The conductive structure of claim 1 , wherein the conductive structure is a waveguide.
6. The conductive structure of claim 1 , wherein individual ones of the horizontal conductive walls are planar.
7. The conductive structure of claim 1 , wherein individual ones of the horizontal conductive walls have rectangular footprints.
8. A passive component in an integrated circuit (IC) package substrate, comprising:
at least one non-circular via; and
at least one pad in contact with the at least one non-circular via;
wherein the passive component includes an inductor or a capacitor, the passive component includes at least two vias having a plurality of fingers extending from a backbone, and the fingers of the two vias are interdigitated.
9. The passive component of claim 8 , wherein the passive component includes a capacitor.
10. The passive component of claim 8 , wherein the passive component includes an inductor.
11. The passive component of claim 10 , wherein the at least one non-circular via has a rectangular footprint.
12. The passive component of claim 10 , wherein the pad has a width between 25 microns and 100 microns.
13. An electrical device, comprising:
a package substrate; and
a die coupled to the package substrate;
wherein the package substrate includes two vertical conductive walls, the two vertical conductive walls each include at least one via and at least one pad, the vias and pads of an individual vertical conductive wall are distributed in a vertical direction relative to each other;
two horizontal conductive walls, wherein the two vertical conductive walls are both in conductive contact with the two horizontal conductive walls; and
a conductive portion, wherein the conductive portion is between the two vertical conductive walls and between the two horizontal conductive walls, the conductive portion has a longitudinal axis along which the conductive portion extends, and the longitudinal axis is perpendicular to the vertical direction.
14. The electrical device of claim 13 , wherein the longitudinal axis of the conductive portion is coplanar with at least one pad of a vertical conductive wall.
15. The electrical device of claim 13 , wherein the conductive portion and the horizontal conductive walls are distributed in a vertical direction relative to each other.
16. The electrical device of claim 13 , further comprising:
an element electrically coupled to the package substrate, wherein the element includes a circuit board or an antenna.
17. An electrical device, comprising:
a package substrate; and
a die coupled to the package substrate;
wherein the package substrate includes a passive component, the passive component includes an inductor or a capacitor, the passive component includes at least two vias having a plurality of fingers extending from a backbone, and the fingers of the two vias are interdigitated.
18. The electrical device of claim 17 , wherein the passive component includes a capacitor.
19. The electrical device of claim 17 , wherein the passive component includes a capacitor.
20. The electrical device of claim 17 , wherein the electrical device is a handheld communication device or a wearable communication device.
21. The electrical device of claim 17 , wherein the electrical device includes a touchscreen.