Patent Assignment
Reel/Frame 045429/0151
Assignment of Assignor's Interest
Recorded: 2018-04-03
Pages: 6
Assignors
GANESAN, SANKA
Executed: 2018-03-14
LAMBERT, WILLIAM JAMES
Executed: 2018-03-23
ZHANG, ZHICHAO
Executed: 2018-03-22
CHAVALI, SRI CHAITRA JYOTSNA
Executed: 2018-03-15
SMITH, STEPHEN ANDREW
Executed: 2018-03-14
HILL, MICHAEL JAMES
Executed: 2018-03-15
JIANG, ZHENGUO
Executed: 2018-03-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, TEXAS, 95054
Covered Property
(1)
Integrated Circuit Structures in Package Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.